Thermalright A70 ARGB Case Review | Thermals, Acoustics, & Build Quality

The Thermalright A70 ARGB case, marking the company’s first entry into PC cases, struggles with design flaws, quality issues, and average thermal performance that fail to justify its $100-$160 price range, especially compared to better-established competitors. While it offers some aesthetic highlights and unique features, these are overshadowed by practical shortcomings, making it a difficult recommendation in a competitive market.

The Thermalright A70 ARGB case marks Thermalright’s first foray into PC cases, diverging from their well-regarded reputation in cooling solutions. However, the case falls short of expectations, especially given its price range of $100 to $160. The design heavily borrows from the Lean Lee O1 Vision, including features like the pyramid front support for glass panels, but lacks refinement and suffers from various issues such as a flawed motherboard tray design, manufacturing defects like unusable USB ports, adhesive bubbling, and poorly conceived drive cages. These problems, combined with wasted internal space and a lack of included fans, make the A70 a tough sell compared to better-established competitors.

Aesthetically, the A70 ARGB offers some positives, including attractive ARGB lighting with a thin LED line around the glass panels and unique rear fan mounts that could support external liquid cooling setups. The removable, vibration-damped side radiator mount is another commendable feature. However, these highlights are overshadowed by practical design flaws such as difficult-to-remove dust filters, impractical glass panel assembly, and limited radiator support. The case also restricts fan sizes to 120mm only, which is unusual in the current market, and the included ARGB hub lacks built-in lighting profiles or daisy chain support.

Thermal performance tests show the A70 delivering average results, often outperformed by similarly priced or even cheaper competitors like the Fractal Pop 2 Vision, Antec Flux series, and Lean Lee cases. The case’s design, particularly the large front panel gap, causes inefficient airflow and air leakage, negatively impacting cooling efficiency. Noise levels at full fan speed are comparable to rivals but do not compensate for the underwhelming thermal results. The absence of included fans further increases the cost for buyers who must purchase cooling fans separately to achieve reasonable performance.

From a market perspective, Thermalright faces significant challenges with the A70. The PC case market is highly competitive and flooded with affordable, well-designed options, especially as component prices and consumer budgets have tightened. Thermalright’s pricing for the A70 does not justify its shortcomings, and the company’s lack of experience in case manufacturing is apparent. While the brand excels in cooling products, this initial case offering lacks the polish, functionality, and value needed to compete effectively.

In conclusion, the Thermalright A70 ARGB case is a disappointing debut in the case market. Despite some aesthetic appeal and a few thoughtful features, it suffers from design oversights, quality control issues, and mediocre thermal performance. Given the abundance of better and more affordable alternatives, the A70 is difficult to recommend at its current price. Thermalright will need to refine its approach and learn from established competitors if it hopes to succeed in the highly competitive PC case market.